TESSERA TECHNOLOGIES
UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer level packaging.
Keywords: UBGA, package stacking, Flash, DRAM, Mobile Memory, Logic Plus Memory, Flash Stacking, DRAM Stacking, Mobile Memory and Logic Plus Memory Stacking
Keywords: UBGA, package stacking, Flash, DRAM, Mobile Memory, Logic Plus Memory, Flash Stacking, DRAM Stacking, Mobile Memory and Logic Plus Memory Stacking
Customer Reviews for TESSERA TECHNOLOGIES
Be the first to review TESSERA TECHNOLOGIES - Use the thumbs to get started!
Click to Rate:
0 thumbs up, 0 thumbs down
0 thumbs up, 0 thumbs down
TESSERA TECHNOLOGIES has not yet completed their interview.
Problem with this listing? Please report it
- ©2024 MecklenburgCountyBusiness List.com
- Privacy Policy
- FAQ
- Contact
This site has been visited 4,737 times